Introduction to IC Packaging Substrate Technology

With the miniaturization and multifunctional nature of electronic products, as well as high-frequency and high-speed digitization of signal transmission, PCB is required to rapidly move towards high-density, high-performance, and high reliability development. In order to meet this requirement, not only are PCBs rapidly moving towards HDIBUM boards, embedded (integrated) component PCBs, etc., but IC packaging substrates have also rapidly transitioned from inorganic substrates (ceramic substrates) to organic substrates (PCB boards). Organic IC packaging substrates are developed by continuing to 'deepen (high-density)' on the basis of HDI/BUM boards: or rather, packaging substrates are HDIBUM boards with brighter density in the county.

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